DocumentCode :
2040530
Title :
Parasitic influence, on signal integrity, of several victim lines placed asymmetrically beside and symmetrically at both sides of an attacker interconnect and mutually
Author :
Ponchel, F. ; Legier, Jf ; Paleczny, E. ; Seguinot, C. ; Deschacht, D.
Author_Institution :
IEMN, Villeneuve d´´Ascq
fYear :
2008
fDate :
12-15 May 2008
Firstpage :
1
Lastpage :
4
Abstract :
Far end crosstalk on victim lines located near an aggressor as well as rise time and propagation delay at the end of the attacker are evaluated. It is done thanks to a home made software based on full wave electromagnetic finite element and transient analysis simulation. These investigations are carried out when the aggressor lossy interconnect of less than one micron square area is symmetrically and asymmetrically placed in an arrangement of three, five and eight copper lossy lines, in case of low, medium and strong mutual effects. Our signal integrity points out that two neighbour lines on both sides of an active interconnect (i.e. the aggressor) are a good compromise to understand more complicated situation on greatest number of unintentionally coupled interconnects. We have verified this fact even in case of small spacing or high permittivity material which filled partially the spacing between interconnects (i.e. strong mutual effects).
Keywords :
computational electromagnetics; copper; crosstalk; delay estimation; electromagnetic wave propagation; finite element analysis; integrated circuit interconnections; permittivity; transient analysis; active interconnects; aggressor lossy interconnects; attacker interconnects; copper lossy lines; far end crosstalk; full wave electromagnetic finite element analysis; high permittivity material; home made software; parasitic influence; propagation delay; signal integrity points; time delay; transient analysis simulation; unintentionally coupled interconnects; victim lines; Conducting materials; Copper; Crosstalk; Dielectric materials; Electromagnetic scattering; Finite element methods; Integrated circuit interconnections; Metallization; Predictive models; Propagation delay;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Conference_Location :
Avignon
Print_ISBN :
978-1-4244-2317-0
Electronic_ISBN :
978-1-4244-2318-7
Type :
conf
DOI :
10.1109/SPI.2008.4558392
Filename :
4558392
Link To Document :
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