DocumentCode :
2040569
Title :
Time and Frequency Domain Modeling, Simulation, and Measurement of a Non-Standard Cabled PCI Express® Channel
Author :
Germann, P. ; Doyle, M. ; Ericson, R. ; Patel, A.
Author_Institution :
IBM Corp., Rochester, MN
fYear :
2008
fDate :
12-15 May 2008
Firstpage :
1
Lastpage :
4
Abstract :
PCI-Expressreg1 specifications have recently been updated to account for transmission across a cabled interface. These specifications are intended to be used with a "standard" cable, and budgeted according to the channel losses and jitter. This paper describes the design and verification of four x8 PCIereg channels which are neither a standard motherboard/plug-in interface, nor a standard cable interface. The channel consists of a commercially available bridge chip and an IBM ASIC driven through two printed circuit boards, two GigArrayreg High-Speed Mezzanine connectors, and a flex cable. Total channel length is roughly 25 inches (~64 cm), with nearly 15 inches in the flex cable. Standard-loss and low-loss dielectric laminates were considered for the flex cable, significant effort was spent carefully designing the flex element. A standard frequency-domain simulator was used to estimate the channel loss based on known transmission constructs in the PCBs and flex cable. Budgets were developed to the PCIe specifications and enforced with PCB and flex cable design constraints from analysis and spec requirements. Prototypes were fabricated in both standard-loss and low-loss materials, and measurements were made on both sets of hardware. A software compliance package (installed on a digital sampling oscilloscope) was used to judge the performance of the channel during system operation. Time-domain HSPICEreg simulation was used to achieve model-to-hardware correlation, and in-situ VNA measurements were used to correlate channel loss budgets in the frequency domain. Based on measurements and analysis, the interface margin on the subsequent production pass of the hardware designs was significantly improved.
Keywords :
application specific integrated circuits; cables (electric); frequency-domain analysis; peripheral interfaces; printed circuit design; time-domain analysis; GigArray High-Speed Mezzanine connectors; IBM ASIC; PCIe channels; bridge chip; cabled interface; channel losses; digital sampling oscilloscope; flex cable; flex element; frequency domain modeling; in-situ VNA measurements; interface margin; jitter; low-loss dielectric laminates; low-loss materials; model-to-hardware correlation; nonstandard cabled PCI express channel; printed circuit boards; software compliance package; standard cable interface; standard frequency-domain simulator; standard motherboard/plug-in interface; standard-loss materials; time domain modeling; time-domain HSPICE simulation; Application specific integrated circuits; Bridge circuits; Connectors; Dielectrics; Flexible printed circuits; Frequency domain analysis; Frequency measurement; Hardware; Jitter; Time measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Conference_Location :
Avignon
Print_ISBN :
978-1-4244-2317-0
Electronic_ISBN :
978-1-4244-2318-7
Type :
conf
DOI :
10.1109/SPI.2008.4558395
Filename :
4558395
Link To Document :
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