DocumentCode :
2040646
Title :
An Efficient Simulation CAD Tool For Interconnect Distribution Functions
Author :
Golzar, Manouchehr Ghahramanian ; Masoumi, Nasser ; Atghiaee, Ahmad
Author_Institution :
Sch. of Electr. & Comput. Eng., Univ. of Tehran, Tehran
fYear :
2008
fDate :
12-15 May 2008
Firstpage :
1
Lastpage :
4
Abstract :
In this paper a new simulation technique is proposed for interconnect structures. It is possible in this technique to take into account the impact of interconnects in early stages of high level design with no need of layout information. For any given digital or mixed mode circuit in the above mentioned technique, one first determines a pre-defined interconnect model with high accuracy and flexibility, then by executing a new and low cost home-made CAD tool, interconnects model is located between any two cells. The output of this technique would be time or frequency domain curves for power, delay and cross talk noise for any given point of the circuit. This technique also gives some other useful information about interconnect density function (IDF) such as total number of interconnects, total, minimum and maximum interconnects lengths with no knowledge about the layout in the first steps in design flow. Simulation results demonstrate the accuracy and efficiency of our developed CAD Tool.
Keywords :
CAD; digital integrated circuits; integrated circuit interconnections; mixed analogue-digital integrated circuits; CAD; cross talk noise; digital circuit; interconnect density function; interconnect distribution functions; mixed mode circuit; Circuit noise; Circuit simulation; Costs; Delay effects; Density functional theory; Design automation; Distribution functions; Flexible printed circuits; Frequency domain analysis; Integrated circuit interconnections;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Conference_Location :
Avignon
Print_ISBN :
978-1-4244-2317-0
Electronic_ISBN :
978-1-4244-2318-7
Type :
conf
DOI :
10.1109/SPI.2008.4558398
Filename :
4558398
Link To Document :
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