DocumentCode :
2040888
Title :
Characterisation of reactive ion etching induced type conversion in HgCdTe
Author :
Nguyen, T. ; Antoszewski, J. ; Musca, C.A. ; Redfern, D.A. ; Dell, J.M. ; Faraone, L.
Author_Institution :
Dept. of Electr. & Electron. Eng., Univ. of Western Australia, Crawley, WA, USA
fYear :
2000
fDate :
2000
Firstpage :
85
Lastpage :
88
Abstract :
Magnetic field dependent differential Hall effect and resistivity measurements have been used to study the transport properties of Au-doped Hg0.77Cd0.23Te which had undergone p to n type conversion by reactive ion etching. Analysing the data by quantitative mobility spectrum analysis shows that after two minutes of etching in a CH4/H2 plasma at 0.4 W cm-2 RF power density, the 17 μm thick H0.77Cd0.23Te epilayer had been totally converted from p- to n-type down to the substrate. This is in stark contrast to results on Hg0.69Cd0.31Te which indicate a conversion depth of 2-3 μm. The analysis indicates the presence of two electron species with peak conductivity at 2.3×105 cm 2 V-1 s-1 and 9.3×104 cm2 V-1 s-1 respectively. A depth profile of these two carriers is also presented.
Keywords :
Hall effect; II-VI semiconductors; cadmium compounds; carrier mobility; electrical conductivity; electrical resistivity; gold; mercury compounds; semiconductor epitaxial layers; sputter etching; 17 micron; 2 min; 2 to 3 micron; CH4/H2 plasma; H2; Hg0.69Cd0.31Te:Au; Hg0.77Cd0.23Te:Au; carrier depth profile; epilayers; magnetic field dependent differential Hall effect; p to n type conversion; peak conductivity; quantitative mobility spectrum analysis; reactive ion etching; resistivity; transport properties; Conductivity measurement; Data analysis; Etching; Hall effect; Magnetic analysis; Magnetic field measurement; Magnetic properties; Mercury (metals); Plasma applications; Tellurium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optoelectronic and Microelectronic Materials and Devices, 2000. COMMAD 2000. Proceedings Conference on
Print_ISBN :
0-7803-6698-0
Type :
conf
DOI :
10.1109/COMMAD.2000.1022896
Filename :
1022896
Link To Document :
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