Title :
Impact of ULK restoration techniques on propagation performance for interconnects of the 45 nm technology node and below
Author :
Gallitre, M. ; Blampey, B. ; Chaabouni, H. ; Farcy, A. ; Grosgeorges, P. ; Lacrevaz, T. ; Bermond, C. ; Flechet, B. ; Ancey, P.
Author_Institution :
Univ. de Savoie, Le Bourget du Lac
Abstract :
The development of advanced ICs architectures for the 45 nm technology node and beyond faces several integration and performance issues. Porous dielectrics are very prone to degradation during process flow, potentially compromising signal integrity. Specific processes such as annealing, restoration treatments, and pore-sealing by liner deposition are considered as potential solutions. Their utility and impact on propagation performance is investigated through both RF measurements and electromagnetic simulations.
Keywords :
annealing; dielectric materials; electromagnetic wave propagation; integrated circuit interconnections; IC architectures; RF measurements; ULK restoration techniques; annealing; electromagnetic simulations; interconnects propagation performance; liner deposition; pore-sealing; porous dielectrics; restoration treatments; Annealing; Copper; Degradation; Dielectric losses; Dielectric materials; Dielectrics and electrical insulation; Driver circuits; Integrated circuit interconnections; Moisture; Performance analysis;
Conference_Titel :
Signal Propagation on Interconnects, 2008. SPI 2008. 12th IEEE Workshop on
Conference_Location :
Avignon
Print_ISBN :
978-1-4244-2317-0
Electronic_ISBN :
978-1-4244-2318-7
DOI :
10.1109/SPI.2008.4558409
