Title :
Development of ultra fine wire for fine pitch bonding
Author :
Ohno, Yasuhide ; Ohzeki, Yoshio ; Yamashita, Toshimitsu ; Iguchi, Yasuo ; Kanamori, Takashi ; Arao, Yoshinori
Abstract :
The development of a 40-μm pitch wire bonding technology for use in development of a 600 DPI LED print head is discussed. To accomplish this, a high-strength super-fine Au-base wire with a diameter of 10 μm was developed, and a suitable wire bonding technology using that wire was determined. A 600 DPI LED technology was experimentally manufactured, and it showed good results in reliability tests
Keywords :
gold alloys; lead bonding; reliability; 10 micron; 40 micron; 600 DPI LED technology; Au alloy wire; Au-base wire; LED print head; diameter; fine pitch bonding; reliability tests; ultra fine wire; wire bonding; Bonding; Flip chip; Light emitting diodes; Manufacturing; Mechanical factors; Metals industry; Research and development; Steel; Wire; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163926
