DocumentCode
2041487
Title
[Front cover]
fYear
2012
fDate
13-16 Dec. 2012
Abstract
The following topics are dealt with: solder materials; design engineering; through silicon via; reliability; LED; power electronics; nanotechnology; integrated circuit interconnection; and integrated circuit bonding.
Keywords
design engineering; integrated circuit bonding; integrated circuit interconnections; light emitting diodes; nanotechnology; power electronics; reliability; solders; three-dimensional integrated circuits; LED; design engineering; integrated circuit bonding; integrated circuit interconnection; nanotechnology; power electronics; reliability; solder materials; through silicon via;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location
Lantau Island
Print_ISBN
978-1-4673-4945-1
Electronic_ISBN
978-1-4673-4943-7
Type
conf
DOI
10.1109/EMAP.2012.6507826
Filename
6507826
Link To Document