Ways to improve reliability of microwave devices

Currently, application conditions of the instruments (vibration, shock, high temperature and so on) become more and more complicated. At the same time, even more often, for example, devices in optical band of wavelengths are interconnected with devices in the radiation range of wavelengths, microwave range of wavelengths and so on. Under these conditions the frequency of failures of devices increases. It is shown that the most difficultly revealed defects of interconnected devices are defects of solder connections of microwave devices. The approach allowing considerably increasing the reliability of solder connections is offered.