Title :
p++-GaAs/n-InGaP heterojunction structure in application to wide-gap channel field-effect transistors
Author :
Lour, W.S. ; Tsai, M.-K. ; Chen, K.-C. ; Yang, Y.J.
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan-Ocean Univ., Taiwan
Abstract :
p++-GaAs/n-InGaP heterojunction field-effect transistors (HJFETs) with a highly carbon-doped gate and a wide-gap channel were reported. A self-aligned T-shaped gate HJFET exhibits a gate of 0.6 μm in length by depositing gate metal of 1.0 μm. DC characteristics including a turn-on voltage of 2.0 V at 1 mA/mm, a gate-drain breakdown voltage up to 30 V, a drain-source breakdown voltage exceeding 25 V, a maximum available transconductance of 160 mS/mm and AC performances such as a unit-current gain frequency of 16.8 GHz, and a unit-power gain frequency of 25 GHz were obtained for a non self-aligned HJFET. With a self-aligned processing structure, the transconductance and fmax were improved to 230 mS/mm and 35 GHz, respectively.
Keywords :
III-V semiconductors; gallium arsenide; indium compounds; junction gate field effect transistors; p-n heterojunctions; 0.6 micron; 16.8 GHz; 160 mS/mm; 2.0 V; 230 mS/mm; 25 GHz; 25 V; 30 V; 35 GHz; AC performance; DC characteristics; GaAs-InGaP; drain-source breakdown voltage; gate length; gate-drain breakdown voltage; highly C-doped gate; maximum available transconductance; non self-aligned HJFET; p++-GaAs/n-InGaP heterojunction structure; self-aligned T-shaped gate HJFET; turn-on voltage; unit-current gain frequency; unit-power gain frequency; wide-gap channel field-effect transistors; Breakdown voltage; Etching; FETs; Fabrication; Frequency; Gallium arsenide; HEMTs; Insulation; Performance gain; Transconductance;
Conference_Titel :
Optoelectronic and Microelectronic Materials and Devices, 2000. COMMAD 2000. Proceedings Conference on
Print_ISBN :
0-7803-6698-0
DOI :
10.1109/COMMAD.2000.1022932