DocumentCode :
2042307
Title :
Quality improvement of bulk soldering of microwave devices
Author :
Shtennikov, V.N. ; Seleznev, V.D.
Author_Institution :
Ural Fed. Univ. (UFU) named after B.N. Yeltsin, Yekaterinburg, Russia
fYear :
2013
fDate :
8-14 Sept. 2013
Firstpage :
786
Lastpage :
787
Abstract :
The analysis of theoretical and experimental data is carried out, the optimization of technological processes of convection, wave and laser soldering is achieved. It is shown that the convection and wave soldering have relatively high precision to ensure optimum soldering temperatures by means of lower temperature difference in the depth of solder connections of manual, or laser soldering. The temperature of the solder joints in laser soldering can be estimated from the heat conduction equation for a semi-infinite plate with a given heat flux at the surface. The temperature of solder joints in a convection soldering can be adequately described by the assumption of regularity of the process of heating.
Keywords :
convection; heat conduction; microwave devices; soldering; bulk soldering quality improvement; convection process; heat conduction equation; heat flux; heating process; laser soldering; microwave devices; optimum soldering temperatures; semiinfinite plate; solder joints; wave process; wave soldering; Electronic mail; Heating; Joints; Lasers; Masers; Printed circuits; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave and Telecommunication Technology (CriMiCo), 2013 23rd International Crimean Conference
Conference_Location :
Sevastopol
Print_ISBN :
978-966-335-395-1
Type :
conf
Filename :
6653062
Link To Document :
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