Quality improvement of bulk soldering of microwave devices

The analysis of theoretical and experimental data is carried out, the optimization of technological processes of convection, wave and laser soldering is achieved. It is shown that the convection and wave soldering have relatively high precision to ensure optimum soldering temperatures by means of lower temperature difference in the depth of solder connections of manual, or laser soldering. The temperature of the solder joints in laser soldering can be estimated from the heat conduction equation for a semi-infinite plate with a given heat flux at the surface. The temperature of solder joints in a convection soldering can be adequately described by the assumption of regularity of the process of heating.