DocumentCode :
2042661
Title :
A BIST methodology for comprehensive testing of ram with reduced heat dissipation
Author :
Cheung, Hugo ; Gupta, Sandeep K.
Author_Institution :
Rockwell Serniconch.tctor Systems zK311 Jamboree Road, MS 502-101 Newport Beach, CA 92660-3095
fYear :
1996
fDate :
20-25 Oct. 1996
Firstpage :
386
Lastpage :
400
Abstract :
The severity of excessive heat dissipation during concurrent BIST of memory modules has been documented by V. Zorian ["A Distributed BIST Control Scheme For Complex VLSI Devices," IEEE VLSI Test Symposium, Mar. 1993, pp 4-9]. In this paper, we present new versions of several memory tests that reduce heat dissipation during testing. Each proposed test has the same fault coverage and time complexity as the original version but it reduces heat dissipation by a factor of two or more. For three of the tests, the heat dissipation is reduced by factors of four to sixteen. The design of BIST circuitry required to implement the proposed tests are presented and it is shown that additional area overhead incurred is very small.
Keywords :
Application specific integrated circuits; Built-in self-test; Circuit faults; Circuit testing; Costs; Hardware; Logic testing; Packaging; Random access memory; System testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Conference, 1996. Proceedings., International
Conference_Location :
Washington, DC, USA
ISSN :
1089-3539
Print_ISBN :
0-7803-3541-4
Type :
conf
DOI :
10.1109/TEST.1996.556985
Filename :
556985
Link To Document :
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