DocumentCode
2042781
Title
Long term behavior of corona resistant insulation compared to standard insulation of magnet wire
Author
Hudon, C. ; Amyot, N. ; Jean, J.
Author_Institution
Inst. de Recherche Hydro-Quebec, IREQ, Varennes, Que.
fYear
2000
fDate
2000
Firstpage
13
Lastpage
16
Abstract
Low voltage motor turn insulation has been aged under stresses similar to those caused by PWM voltage pulses. Commercial standard turn insulation was tested in parallel with a new inverter grade corona resistant (CR) insulation. Both types of insulation were subjected to fast bipolar pulses at 80°C and at 130°C. When the maximum peak voltage was set to 620 V, below the discharge inception voltage (DIV), no failure was recorded on either insulation system, after aging times of 280 days. When the pulse peak voltage was increased to 830 V, failures rapidly occurred on all specimens with standard insulation and later for all specimens with CR insulation. A third aging test was carried out at 750 V. Here, at 80°C, all specimens with CR insulation failed before the specimens with standard insulation. The mean time to failure for CR material was of 133 hours, while it was larger than 1070 hours for the standard type insulation at the same temperature. This behavior was not observed at 130°C and 750 V
Keywords
AC motor drives; PWM invertors; insulation testing; life testing; organic insulating materials; partial discharges; variable speed drives; 130 C; 620 V; 720 V; 80 C; 840 V; LV motor turn insulation; PWM drives; PWM voltage pulses; adjustable speed drives; aging test; corona resistant insulation; discharge inception voltage; fast bipolar pulses; inverter grade insulation; life test; long term behavior; magnet wire standard insulation; mean time to failure; pulse peak voltage; Aging; Chromium; Corona; Insulation testing; Low voltage; Pulse width modulation; Pulse width modulation inverters; Space vector pulse width modulation; Stress; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 2000. Conference Record of the 2000 IEEE International Symposium on
Conference_Location
Anaheim, CA
ISSN
1089-084X
Print_ISBN
0-7803-5931-3
Type
conf
DOI
10.1109/ELINSL.2000.845409
Filename
845409
Link To Document