Feasibility of PBGA packaging for high random vibration applications

In this study, the solder joint reliability of plastic ball grid array under harsh random vibration and thermal loadings was investigated. The chips were assembled on the daisy chained circuit boards for the test samples preparation, and part of the samples was processed for underfill to investigate the underfill effects on the solder failures. Two consequential steps of the random vibrations, named as the qualification and acceptance levels, were applied by pneumatic shaker. Overall controlled RMS of the power spectrum densities of the steps were 22.7 Grms and 32 Grms, respectively. Then the samples were undergone to thermal cycling tests. It was found that the samples survived without any solder failure during the test requirements, demonstrating the robustness of the packaging structure for potential avionics and space applications.