Title :
Color consistence improvement in LED packages
Author :
Wong, C.K.Y. ; Leung, Stanley Y. Y. ; Lin Niu ; Gongqi Fan ; Xiang Zhou ; Yuan, Cadmus C. A. ; Guoqi Zhang ; Yanglin Li ; Menglong Tu ; ShaoFang Wang
Author_Institution :
F7 R&D HUB, State Key Lab. of Solid State Lighting (Changzhou Base), China
Abstract :
This paper studies the processing parameters in LED package manufacturing which leads to poor color consistence in the LED packages. With 4 process parameters including die color co-ordinate, dispensing idle time, curing idle time and curing temperature, the critical parameters in affecting the LED package color quality has been investigated by design of experiment. In the analysis of variance, the die color co-ordinate and the dispensing idle time has been found as the critical factors for color derivation from the target, with the later to be the most critical. A regression equation that describes the relationship has been obtained and validated with the measurement data. The equation helps process engineer to design the process window for controllable color variation with production yield improvement. It also helps in die bins selection for a given color reproducibility requirement.
Keywords :
colour; curing; design of experiments; electronics packaging; light emitting diodes; regression analysis; LED package color quality; LED package manufacturing; analysis of variance; color consistence improvement; color derivation; color reproducibility; controllable color variation; curing idle time; curing temperature; design of experiment; die bins selection; die color coordinate; dispensing idle time; process window; processing parameters; production yield; regression equation;
Conference_Titel :
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location :
Lantau Island
Print_ISBN :
978-1-4673-4945-1
Electronic_ISBN :
978-1-4673-4943-7
DOI :
10.1109/EMAP.2012.6507883