Preparation and performance research on the Si3N4@SiO2/PI nanocomposite

Author

Jing Qin ; Guoping Zhang ; Rong Sun ; Chingping Wong

Author_Institution

Shenzhen Inst. of Adv. Technol., Shenzhen, China

fYear

2012

fDate

13-16 Dec. 2012

Firstpage

1

Lastpage

4

Abstract

The novel core (Si₃N₄)-shell (SiO₂) (Si₃N₄@SiO₂) nanoparticles were successfully prepared via the Stöber process, using the Si₃N₄ nanoparticles as the seeds. The silica coated Si₃N₄ composite particles were prepared by hydrolysis-condensation polymerization of tetraethylorthosilicate (TEOS) on the surface of Si₃N₄ particles. Then, Si₃N₄@SiO₂ nanoparticles were introduced into the polyimide (PI) matrix to prepare the organic-inorganic hybrid nanocomposite film, and the dielectric behavior and heat-conducting property of the composite were investigated. The results showed that the thermal conductivity has been raised by 100% from 0.203 W/m·K to 0.441 W/m·K. and Si₃N₄@SiO₂/PI composites possess lower dielectric constant compared to the Si₃N₄ /PI composites, which is benefit for use of inter-level dielectric.

Keywords

condensation; filled polymers; heat conduction; materials preparation; nanocomposites; nanoparticles; organic-inorganic hybrid materials; polymerisation; semiconductor thin films; silicon compounds; thermal conductivity; PI nanocomposite; Si₃N₄-SiO₂; Stöber process; TEOS; core-shell nanoparticles; dielectric behavior; dielectric constant; heat-conducting property; hydrolysis-condensation polymerization; inter-level dielectric; organic-inorganic hybrid nanocomposite film; polyimide matrix; silica coated composite particles; tetraethylorthosilicate; thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging (EMAP), 2012 14th International Conference on

Conference_Location

Lantau Island

Print_ISBN

978-1-4673-4945-1

Electronic_ISBN

978-1-4673-4943-7

Type

conf

DOI

10.1109/EMAP.2012.6507895

Filename

6507895