Title :
Preparation and performance research on the Si3N4@SiO2/PI nanocomposite
Author :
Jing Qin ; Guoping Zhang ; Rong Sun ; Chingping Wong
Author_Institution :
Shenzhen Inst. of Adv. Technol., Shenzhen, China
Abstract :
The novel core (Si3N4)-shell (SiO2) (Si3N4@SiO2) nanoparticles were successfully prepared via the Stöber process, using the Si3N4 nanoparticles as the seeds. The silica coated Si3N4 composite particles were prepared by hydrolysis-condensation polymerization of tetraethylorthosilicate (TEOS) on the surface of Si3N4 particles. Then, Si3N4@SiO2 nanoparticles were introduced into the polyimide (PI) matrix to prepare the organic-inorganic hybrid nanocomposite film, and the dielectric behavior and heat-conducting property of the composite were investigated. The results showed that the thermal conductivity has been raised by 100% from 0.203 W/m·K to 0.441 W/m·K. and Si3N4@SiO2/PI composites possess lower dielectric constant compared to the Si3N4 /PI composites, which is benefit for use of inter-level dielectric.
Keywords :
condensation; filled polymers; heat conduction; materials preparation; nanocomposites; nanoparticles; organic-inorganic hybrid materials; polymerisation; semiconductor thin films; silicon compounds; thermal conductivity; PI nanocomposite; Si3N4-SiO2; Stöber process; TEOS; core-shell nanoparticles; dielectric behavior; dielectric constant; heat-conducting property; hydrolysis-condensation polymerization; inter-level dielectric; organic-inorganic hybrid nanocomposite film; polyimide matrix; silica coated composite particles; tetraethylorthosilicate; thermal conductivity;
Conference_Titel :
Electronic Materials and Packaging (EMAP), 2012 14th International Conference on
Conference_Location :
Lantau Island
Print_ISBN :
978-1-4673-4945-1
Electronic_ISBN :
978-1-4673-4943-7
DOI :
10.1109/EMAP.2012.6507895
