IGBT power module packaging for EV applications

Insulated gate bipolar transistor (IGBT modules are widely used in power electronics applications such as vehicle and household applications as well as industry to realize energy savings with higher efficiency, smaller size, low cost, higher reliability and more environmental safety. However, due to the large power generation of IGBT and diode chips and harsh application environment of vehicle applications, reliability is an important issue. In this paper, the 600V, 450A IGBT high power module packaging technologies for electrical vehicle are developed and verified. The integrated optimum design of thermal, stress and electrical designs is established. Power module assembly technologies with high reliability include chip and DBC (direct bond copper) bonding with low void rate, heavy Al wire bonding and module encapsulation are developed. Finally, the performance of power module is verified by module testing and EV platform testing. The results show that the optimum design and assembly process can reduce junction temperature, thermal stress and parasitic effects of IGBT power modules. The power modules have good performance that can successfully pass through the module and EV platform tests.