Title :
A multilevel epoxy substrate for flip-chip hybrid multichip module applications
Author :
Tsunashima, Eiichi ; Okuno, Atsushi
Author_Institution :
Matsushita Electron. Corp., Kyoto, Japan
Abstract :
A multilevel substrate consisting of two portions of a multiple multilayer is discussed. One portion is thicker than the other, reinforced by organic fiber in each layer; the other is an unreinforced thick film which forms low dielectric-constant layers. A sophisticated epoxy-resin two-dimensional support, but its adhesion strength between the epoxy layers, stabilizes the elongation, shrink and warp by one-order smaller compared to the substrate of FR-4 with inorganic reinforcement. The resin of an aromatic-amine adducted type may lower the dielectric constant making it suitable for high-frequency circuits and it is an excellent acceptor of both copper-foil and copper-plated electrodes. This two-portion substrate enables ideal flip-chip bonding on thick-film hybrid circuits, gives the necessary impedance of semiconductor-circuit, and leaves a compatible zone for wire bonding and a reflow soldering
Keywords :
flip-chip devices; microassembling; substrates; MCM; MLB; dielectric constant; flip-chip bonding; flip-chip hybrid; high-frequency circuits; impedance control; multichip module; multilayer board; multilevel epoxy substrate; multilevel substrate; multiple multilayer; permittivity; reflow soldering; thick-film hybrid circuits; two-portion substrate; wire bonding; Adhesives; Bonding; Circuits; Dielectric constant; Dielectric substrates; Electrodes; Multichip modules; Nonhomogeneous media; Resins; Thick films;
Conference_Titel :
Electronic Components and Technology Conference, 1991. Proceedings., 41st
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-0012-2
DOI :
10.1109/ECTC.1991.163939
