• DocumentCode
    2045462
  • Title

    An optical wireless bistable micro-actuator

  • Author

    Xingxing Liu ; Al Hajjar, Hani ; Lamarque, Frederic ; Dore, Emmanuel ; Carton, Olivier ; Zeinert, Andreas ; Charvet, Stephane

  • Author_Institution
    Univ. de Technol. de Compiegne, Compiegne, France
  • fYear
    2015
  • fDate
    2-5 Aug. 2015
  • Firstpage
    1624
  • Lastpage
    1629
  • Abstract
    An optical wireless bistable micro-actuator is presented in this paper. The bistable mechanism is based on antagonistic pre-shaped double beams, which have the merits of simple pre-load operation and symmetrical output force. The bistable micro-actuator was fabricated with deep reactive ion etching (DRIE) technique using silicon on insulator (SOI) wafer. The bistable beam has a thickness of 25 μm and a depth of 400 μm. The stroke of the bistable micro-actuator is 300 μm. An 8 μm thick compressive SiO2 layer is deposited on one side of the strip shaped (0.1×1×3 mm) shape memory alloy (SMA) active element, acting as the biasing spring. The SiO2 layer created a two way memory effect and eliminated the load effect of SMA element. Stroke of SMA element is tested. The wireless actuation was realized by laser heated SMA active element.
  • Keywords
    microactuators; shape memory effects; sputter etching; DRIE; SMA; SOI; antagonistic preshaped double beams; biasing spring; bistable mechanism; deep reactive ion etching technique; laser heated SMA active element; optical wireless bistable microactuator; preload operation; silicon on insulator wafer; strip shaped shape memory alloy active element; symmetrical output force; thick compressive SiO2 layer; two way memory effect; Force; Heating; Laser beams; Optical beams; Shape; Switches; Wireless communication; Bistable micro-actuator; Micro-fabrication; Wireless actuation; shape memory alloy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation (ICMA), 2015 IEEE International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-7097-1
  • Type

    conf

  • DOI
    10.1109/ICMA.2015.7237728
  • Filename
    7237728