Development of damage detection system for surface mount packages during reflow soldering

A damage detection system for surface mount packages during reflow soldering has been developed to efficiently evaluate reliability of packages quantitatively. This system is based on measuring the deformation of the packages in the direction of the thickness. A personal computer automatically determines the damage mode and the temperature at which the damage occurred by the displacement profile and the temperature profile. The three possible damage modes-package cracking, delamination of the plastic, and leakage of vapor, which leaves gaps between the plastic and the leads-can be identified by this system