DocumentCode
2046290
Title
Mechanical simulation and test of force-sensitive element in surface acoustic wave contact stress sensor
Author
Haining Li ; Jiexiong Ding ; Yunpeng Zhang ; Bowen Chu ; Guangmin Liu
Author_Institution
Sch. of Mech., Electron., & Ind. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2015
fDate
2-5 Aug. 2015
Firstpage
1790
Lastpage
1794
Abstract
In some harsh environments such as thin slits, the contact stress measurement with passive and wireless method faces huge challenges. In this paper a contact stress sensing system based on surface acoustic wave resonator (SAWR) is schemed, and the force-sensitivity element based on diaphragm structure is constructed. To meet the requirements in slits, the overall thickness of the device is limited under 400 μm. Moreover, the force-sensitive element with three parameters including shape, width and thickness of the cavity are built and simulated in FEA software (COMSOL Multiphysics). And the stress and strain results are discussed so as to determine proper parameters of sensor. Finally, the particular sensor based on circular diaphragm is manufactured and tested. The loading test results in 0-4MPa show that the sensor has a good linearity, and the sensitivity is 20.5 kHz/MPa. Therefore, this approach is proved to be feasible to monitor the contact stress in slits, which provides a novel method for physical quantity measurements in harsh environments as well.
Keywords
diaphragms; finite element analysis; stress measurement; surface acoustic wave resonators; COMSOL Multiphysics; FEA software; cavity shape; cavity thickness; cavity width; circular diaphragm; diaphragm structure; force-sensitive element; harsh environments; loading test; mechanical simulation; mechanical test; strain; surface acoustic wave contact stress sensor; Cavity resonators; Sensitivity; Sensors; Strain; Stress; Substrates; Surface acoustic waves; contact stress; diaphragm; force-sensitive element; surface acoustic wave resonator;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation (ICMA), 2015 IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4799-7097-1
Type
conf
DOI
10.1109/ICMA.2015.7237757
Filename
7237757
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