Title :
First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)
Keywords :
adhesives; circuit reliability; conducting polymers; encapsulation; flip-chip devices; integrated circuit packaging; materials testing; microassembling; molecular electronics; optical polymers; plastic packaging; polymer films; adhesives; encapsulation technologies; flexible systems; flip chip; isotropic conductive adhesives; materials characterization; materials development; materials testing; microelectronics; packaging applications; photonic polymers; photonics; polymer electronic devices; polymer substrates; polymers; reliability;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location :
Potsdam, Germany
Print_ISBN :
0-7803-7220-4
DOI :
10.1109/POLYTR.2001.973246
