Title :
New fabrication technology of polymer/metal lamination and its application in electronic packaging
Author :
Suga, Tadatomo ; Takahashi, Atsushi ; Saijo, Kinji ; Oosawa, Shinji
Author_Institution :
Tokyo Univ., Japan
Abstract :
A new fabrication technology for lamination between LCP (liquid crystalline polymer)and copper is presented. The method is based on a surface activation process prior to the clad bonding process. The fabrication conditions and the microstructure of the bonded interface as well as the mechanism of the bonding are discussed with respect to various experimental results. Some practical applications of the new clad materials in electronic packaging are also presented.
Keywords :
copper; interface structure; laminates; liquid crystal polymers; packaging; surface chemistry; LCP-copper laminates; bonded interface microstructure; bonding mechanism; clad bonding process; clad materials; electronic packaging; fabrication conditions; fabrication technology; liquid crystalline polymer; polymer/metal lamination; surface activation process; Bonding; Copper; Electronic packaging thermal management; Electronics packaging; Fabrication; Laminates; Lamination; Liquid crystal polymers; Printed circuits; Surface contamination;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location :
Potsdam, Germany
Print_ISBN :
0-7803-7220-4
DOI :
10.1109/POLYTR.2001.973251
