• DocumentCode
    2046642
  • Title

    Advanced micro-dispensing system for conductive adhesives

  • Author

    Gaugel, Tobias ; Bechtel, Sascha ; Neumann-Rodekirch, Jens

  • Author_Institution
    Fraunhofer Inst. for Manuf. Eng. & Autom., Stuttgart, Germany
  • fYear
    2001
  • fDate
    21-24 Oct. 2001
  • Firstpage
    40
  • Lastpage
    45
  • Abstract
    As part of this paper, systems suitable for the micro-dispensing of conductive adhesives are presented and their advantages and disadvantages are also discussed. Additionally, cause-and-effect correlations of various influencing parameters are presented and analyzed, both for dispensing systems and for robotics. A further central theme is made up by the geometries of suitable needles for the precision dispensing of conductive adhesives. In closing, a new technique developed at the Fraunhofer IPA for the high-accuracy dispensing of conductive epoxy resins is presented. The most important part of the new system is a micro-pump system combined with pneumatic micro-valve actuators.
  • Keywords
    adhesives; conducting polymers; industrial robots; materials handling; microactuators; microassembling; microfluidics; micropumps; microvalves; plastic packaging; robot kinematics; cause-and-effect correlations; conductive adhesives; conductive epoxy resins; dispensing accuracy; dispensing needles; dispensing systems; influencing parameters; micro-dispensing system; micro-pump system; pneumatic micro-valve actuators; precision dispensing; robotics; Computational geometry; Conductive adhesives; Fasteners; Joining processes; Manufacturing automation; Manufacturing industries; Micropumps; Needles; Robots; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
  • Conference_Location
    Potsdam, Germany
  • Print_ISBN
    0-7803-7220-4
  • Type

    conf

  • DOI
    10.1109/POLYTR.2001.973253
  • Filename
    973253