DocumentCode
2046642
Title
Advanced micro-dispensing system for conductive adhesives
Author
Gaugel, Tobias ; Bechtel, Sascha ; Neumann-Rodekirch, Jens
Author_Institution
Fraunhofer Inst. for Manuf. Eng. & Autom., Stuttgart, Germany
fYear
2001
fDate
21-24 Oct. 2001
Firstpage
40
Lastpage
45
Abstract
As part of this paper, systems suitable for the micro-dispensing of conductive adhesives are presented and their advantages and disadvantages are also discussed. Additionally, cause-and-effect correlations of various influencing parameters are presented and analyzed, both for dispensing systems and for robotics. A further central theme is made up by the geometries of suitable needles for the precision dispensing of conductive adhesives. In closing, a new technique developed at the Fraunhofer IPA for the high-accuracy dispensing of conductive epoxy resins is presented. The most important part of the new system is a micro-pump system combined with pneumatic micro-valve actuators.
Keywords
adhesives; conducting polymers; industrial robots; materials handling; microactuators; microassembling; microfluidics; micropumps; microvalves; plastic packaging; robot kinematics; cause-and-effect correlations; conductive adhesives; conductive epoxy resins; dispensing accuracy; dispensing needles; dispensing systems; influencing parameters; micro-dispensing system; micro-pump system; pneumatic micro-valve actuators; precision dispensing; robotics; Computational geometry; Conductive adhesives; Fasteners; Joining processes; Manufacturing automation; Manufacturing industries; Micropumps; Needles; Robots; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location
Potsdam, Germany
Print_ISBN
0-7803-7220-4
Type
conf
DOI
10.1109/POLYTR.2001.973253
Filename
973253
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