• DocumentCode
    2047191
  • Title

    Application of space domain integral equation technique for high frequency description of open microstrip discontinuities

  • Author

    Andriychuk, Mykhaylo

  • Author_Institution
    Inst. of Appl. Problems of Mech. & Math., NASU, Lviv
  • fYear
    2008
  • fDate
    21-24 May 2008
  • Firstpage
    32
  • Lastpage
    36
  • Abstract
    The full-wave electrodynamical analysis of the open microwave discontinuities is performed by the space domain integral equation approach. This approach employs the dyadic Green´s functions for a grounded multi-layer dielectric configuration and can be used on a single or multi-layer dielectric with or without superstrate. The method of moments is used for numerical solving the received equation. Elements of respective impedance matrix are calculated by combination of analytical and numerical integration. The characteristic network parameters of structure are determined on the know matrix elements.
  • Keywords
    Green´s function methods; dielectric materials; electrodynamics; integral equations; method of moments; micromechanical devices; microstrip components; MEMS; dyadic Green´s functions; full-wave electrodynamical analysis; high frequency description; impedance matrix; method of moments; multi-layer dielectric configuration; open microstrip discontinuities; open microwave discontinuities; space domain integral equation technique; Dielectrics; Electromagnetic analysis; Electromagnetic fields; Frequency; Green´s function methods; Integral equations; Micromechanical devices; Microstrip components; Moment methods; Transmission line matrix methods; Impedance Matrix; Integral Equation; Method of Moments; Microstrip Discontinuity; Network Parameters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Perspective Technologies and Methods in MEMS Design, 2008. MEMSTECH 2008. International Conference on
  • Conference_Location
    Polyana
  • Print_ISBN
    978-966-2191-00-4
  • Type

    conf

  • DOI
    10.1109/MEMSTECH.2008.4558729
  • Filename
    4558729