Title :
Three-dimensional (3D) ICs: a technology platform for integrated systems and opportunities for new polymeric adhesives
Author :
Gutmann, R.J. ; Lu, J.-Q. ; Kwon, Y. ; McDonald, J.F. ; Cale, T.S.
Author_Institution :
Interconnect Focus Center for Gigascale Integration, Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
Three-dimensional (3D) ICs offer increased performance of digital lCs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare/sup TM/, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.
Keywords :
adhesives; copper; dielectric thin films; integrated circuit interconnections; integrated circuit metallisation; polymers; wafer bonding; 200 mm; 200 mm diameter wafers; 3D IC; Cu; Flare; copper damascene patterning; dielectric glue layers; digital lCs; heterogeneous integration; nonfluorinated polyaryl ether; polymeric adhesives; wafer bonding; wafer thinning; Chemical technology; Copper; Costs; Dielectrics; Integrated circuit interconnections; Integrated circuit technology; Packaging; Planarization; Polymers; Wafer scale integration;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location :
Potsdam, Germany
Print_ISBN :
0-7803-7220-4
DOI :
10.1109/POLYTR.2001.973276
