Three-dimensional (3D) ICs: a technology platform for integrated systems and opportunities for new polymeric adhesives

Author

Gutmann, R.J. ; Lu, J.-Q. ; Kwon, Y. ; McDonald, J.F. ; Cale, T.S.

Author_Institution

Interconnect Focus Center for Gigascale Integration, Rensselaer Polytech. Inst., Troy, NY, USA

fYear

2001

fDate

21-24 Oct. 2001

Firstpage

173

Lastpage

180

Abstract

Three-dimensional (3D) ICs offer increased performance of digital lCs, heterogeneous integration for numerous applications and lower manufacturing cost for electronic and optoelectronic systems. After a discussion of alternative 3D integration technologies, our approach of using dielectric glue layers for attachment of fully processed 200mm diameter wafers (followed by top wafer thinning and inter-wafer interconnection with copper damascene patterning) is described. The wafer bonding process is highlighted, and requirements for polymeric adhesives for this application are described. Results with Flare/sup TM/, a non-fluorinated poly aryl ether, are presented in detail and serve as a baseline for alternative adhesives.

Keywords

adhesives; copper; dielectric thin films; integrated circuit interconnections; integrated circuit metallisation; polymers; wafer bonding; 200 mm; 200 mm diameter wafers; 3D IC; Cu; Flare; copper damascene patterning; dielectric glue layers; digital lCs; heterogeneous integration; nonfluorinated polyaryl ether; polymeric adhesives; wafer bonding; wafer thinning; Chemical technology; Copper; Costs; Dielectrics; Integrated circuit interconnections; Integrated circuit technology; Packaging; Planarization; Polymers; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on

Conference_Location

Potsdam, Germany

Print_ISBN

0-7803-7220-4

Type

conf

DOI

10.1109/POLYTR.2001.973276

Filename

973276