Fundamental studies of isotropic conductive adhesives focused on the current loadability of ICA for flip chip applications

Author

Haberland, Julian ; Kallmayer, Christine ; Aschenbrenner, Rolf ; Reichl, Herbert

Author_Institution

Res. Center Microperipheric Technol., Berlin Tech. Univ., Germany

fYear

2001

fDate

21-24 Oct. 2001

Firstpage

185

Lastpage

195

Abstract

The first part of the study focuses on fundamental investigations performed on printed ICA test structures (epoxy vs. thermoplastic resin). Measurings of the conductivity during cure have been made. The results have been related with DSC/TMA data. As well electrical performance of the cured adhesives under elevated temperature/humidity and high current loads have been determined. In the second part of the study first results obtained from high current tests on Flip Chip packages are presented. Limitations and mechanisms of failure are discussed.

Keywords

adhesives; conducting polymers; differential scanning calorimetry; electrical conductivity measurement; flip-chip devices; humidity; integrated circuit testing; thermal stability; DSC/TMA; conductivity; current tests; electrical performance; elevated humidity; elevated temperature; epoxy resin; flip chip packages; printed ICA; thermoplastic resin; Conductive adhesives; Conductivity measurement; Flip chip; Humidity; Independent component analysis; Packaging; Performance evaluation; Resins; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on

Conference_Location

Potsdam, Germany

Print_ISBN

0-7803-7220-4

Type

conf

DOI

10.1109/POLYTR.2001.973278

Filename

973278