• DocumentCode
    2047385
  • Title

    Fracture mechanical analysis of cracks in polymer encapsulated metal structures

  • Author

    Wittler, Olaf ; Sprafke, Peter ; Auersperg, Jürgen ; Michel, Bernd ; Reichl, Herbert

  • Author_Institution
    Robert Bosch GmbH, Stuttgart, Germany
  • fYear
    2001
  • fDate
    21-24 Oct. 2001
  • Firstpage
    203
  • Lastpage
    208
  • Abstract
    Cracks inside polymeric packaging materials, which are used for protection and isolation of electronic components, can lead to failure of the whole system. In this presentation, the loading situation of cracks inside the polymer of encapsulated metal structures is analysed. The analysis is based on finite element simulations of thermally induced stresses. In a first approach, a linear elastic material model is assumed in combination with the application of linear elastic fracture concepts. The load of the crack is shown to be influenced by geometrical factors like its own initial form and length. Moreover, the occurrence of delamination in the interface between the metal and polymer can be very important, as it severely influences the crack front inside the polymer. The results of this analysis are compared to experimental observations and show good correlation. It is shown how the model can be improved by the application of a viscoelastic material model for the encapsulation material.
  • Keywords
    cracks; delamination; encapsulation; filled polymers; finite element analysis; fracture mechanics; fracture toughness; plastic packaging; crack front; crack initiation; crack propagation; cracks; delamination; encapsulation material; finite element simulations; fracture mechanical analysis; fracture toughness; linear elastic material model; metal polymer interface; polymer encapsulated metal structures; polymeric packaging materials; thermally induced stresses; viscoelastic material model; Analytical models; Delamination; Elasticity; Electronic components; Electronic packaging thermal management; Finite element methods; Polymers; Protection; Thermal stresses; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
  • Conference_Location
    Potsdam, Germany
  • Print_ISBN
    0-7803-7220-4
  • Type

    conf

  • DOI
    10.1109/POLYTR.2001.973281
  • Filename
    973281