Title :
Effects of HDI material for laser via hole forming
Author :
Mikado, Yukinobu
Author_Institution :
Ibiden Co. Ltd., Gifu, Japan
Abstract :
LVH (Laser Via Hole) forming is becoming the main current technology of micro-via forming in the process of build-up PWB. It was effected by the development of laser drilling technology. There are many kinds of HDI material for LVH forming: RCF (Resin Coated copper Foil), glass-epoxy, aramid, etc. The author studies the effective factors of HDI materials for LVH forming. The main conclusions are: the thermal decomposition temperature of HDI material is related to the bottom diameter of LVH; the reliability of LVH connection can be kept in any HDI materials, depending on good laser conditions for each material; and HDI material needs to be selected to meet the requirement for each product.
Keywords :
circuit reliability; filled polymers; interconnections; laser beam machining; printed circuit manufacture; HDI material; LVH connection reliability; LVH forming; aramid; build-up PWB; glass-epoxy; laser drilling technology; laser via hole forming; micro-via forming; resin coated copper foil; thermal decomposition temperature; Copper; Dielectric constant; Dielectric materials; Drilling; Laser beams; Mobile handsets; Optical materials; Resins; Shape measurement; Wiring;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location :
Potsdam, Germany
Print_ISBN :
0-7803-7220-4
DOI :
10.1109/POLYTR.2001.973283
