DocumentCode :
2047686
Title :
Research of a thermoelasticity of semiconducting microstructures
Author :
Konstantin, Kolesnyk ; Roman, Panchak
Author_Institution :
CAD/CAM Dept., Lviv Polytech. Nat. Univ., Lviv
fYear :
2008
fDate :
21-24 May 2008
Firstpage :
94
Lastpage :
94
Abstract :
In paper the outcomes of research of a thermoelasticity of semiconducting structures MEMS represented. The analytical model for research of a thermoelasticity of microstructures designed.
Keywords :
micromechanical devices; monolithic integrated circuits; thermoelasticity; MEMS; semiconducting microstructures; thermoelasticity; Finite element methods; Micromechanical devices; Microstructure; Power engineering and energy; Reliability engineering; Semiconductivity; Silicon; Temperature; Thermal stresses; Thermoelasticity; microelectromechanical system (MEMS); semiconducting microstructure; thermoelasticity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Perspective Technologies and Methods in MEMS Design, 2008. MEMSTECH 2008. International Conference on
Conference_Location :
Polyana
Print_ISBN :
978-966-2191-00-4
Type :
conf
DOI :
10.1109/MEMSTECH.2008.4558750
Filename :
4558750
Link To Document :
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