DocumentCode
2047809
Title
The reliability analysis of thermal design software system
Author
Fedasyuk, Dmyrtro ; Seniv, Maksym ; Serdyuk, Pavlo
fYear
2008
fDate
21-24 May 2008
Firstpage
122
Lastpage
122
Abstract
For the software reliability testing the model of software reliability estimation, which is based on the random Poisson process, has been used, which determines and allows to forecast the software fault probability and its reliability in the set moment of time. The software environment of computer-aided testing for the verification of computational software for the solution of thermal conductivity problems has been developed. Keywords - software reliability,
Keywords
program testing; program verification; software fault tolerance; computational software verification; computer-aided testing; random Poisson process; software fault probability; software reliability estimation; software reliability testing; thermal conductivity problems; thermal design software system; Analytical models; Automatic testing; Computer errors; Frequency estimation; Software design; Software reliability; Software systems; Software testing; System testing; Thermal conductivity; software reliability; testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Perspective Technologies and Methods in MEMS Design, 2008. MEMSTECH 2008. International Conference on
Conference_Location
Polyana
Print_ISBN
978-966-2191-00-4
Type
conf
DOI
10.1109/MEMSTECH.2008.4558757
Filename
4558757
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