Smart labels-high volume applications using adhesive flip-chip-technologies

Author

Kriebel, F. ; Seidowski, Th

Author_Institution

KSW Microtec GmbH, Dresden, Germany

fYear

2001

fDate

21-24 Oct. 2001

Firstpage

304

Lastpage

308

Abstract

The authors present requirements, conditions and experiences for the production of smart labels in a reel-to-reel assembly technique. They compare different adhesive flip-chip technologies as well as different types of adhesives for smart label production schemes. Technology advantages for low cost substrates like PET in combination with copper or aluminium antenna tracks are presented. Besides the technology and material adaptations, electrical and mechanical properties of flip-chip interconnections are presented. In the last part of the paper, the authors present a new generation of smart labels-active working smart labels. These labels include a battery and additional electronic functions.

Keywords

adhesives; conducting polymers; flip-chip devices; identification technology; integrated circuit interconnections; integrated circuit reliability; microassembling; PET; RFID labels; active working smart labels; adhesive flip-chip-technologies; adhesive types; aluminium antenna tracks; battery; copper antenna tracks; electrical properties; electronic functions; flip-chip interconnections; generic assembly technology; high volume applications; joining technology; low cost substrate materials; mechanical properties; reel-to-reel assembly technique; smart labels; Assembly; Bonding; Conductive adhesives; Consumer electronics; Costs; Flip chip; Logistics; Marketing and sales; Production; Radiofrequency identification;

fLanguage

English

Publisher

ieee

Conference_Titel

Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on

Conference_Location

Potsdam, Germany

Print_ISBN

0-7803-7220-4

Type

conf

DOI

10.1109/POLYTR.2001.973299

Filename

973299