Title :
Smart labels-high volume applications using adhesive flip-chip-technologies
Author :
Kriebel, F. ; Seidowski, Th
Author_Institution :
KSW Microtec GmbH, Dresden, Germany
Abstract :
The authors present requirements, conditions and experiences for the production of smart labels in a reel-to-reel assembly technique. They compare different adhesive flip-chip technologies as well as different types of adhesives for smart label production schemes. Technology advantages for low cost substrates like PET in combination with copper or aluminium antenna tracks are presented. Besides the technology and material adaptations, electrical and mechanical properties of flip-chip interconnections are presented. In the last part of the paper, the authors present a new generation of smart labels-active working smart labels. These labels include a battery and additional electronic functions.
Keywords :
adhesives; conducting polymers; flip-chip devices; identification technology; integrated circuit interconnections; integrated circuit reliability; microassembling; PET; RFID labels; active working smart labels; adhesive flip-chip-technologies; adhesive types; aluminium antenna tracks; battery; copper antenna tracks; electrical properties; electronic functions; flip-chip interconnections; generic assembly technology; high volume applications; joining technology; low cost substrate materials; mechanical properties; reel-to-reel assembly technique; smart labels; Assembly; Bonding; Conductive adhesives; Consumer electronics; Costs; Flip chip; Logistics; Marketing and sales; Production; Radiofrequency identification;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2001. First International IEEE Conference on
Conference_Location :
Potsdam, Germany
Print_ISBN :
0-7803-7220-4
DOI :
10.1109/POLYTR.2001.973299
