• DocumentCode
    2047861
  • Title

    Towards an effective IDDQ test vector selection and application methodology

  • Author

    Van Sas, Jos ; Swerts, Urbin ; Darquennes, Marc

  • Author_Institution
    Telecom Res. Div., Alcatel Telecom, Antwerpen, Belgium
  • fYear
    1996
  • fDate
    20-25 Oct 1996
  • Firstpage
    491
  • Lastpage
    500
  • Abstract
    We show that that for a complex CLSI (1.4 M transistor used in the Asymmetric Digital Subscriber Line product range), 632 IDDQ measurements are needed to obtain 94% pseudo stuck-at fault coverage. The IDDQ test takes less than 200 ms on the VLSI test system, which is between 100 to 300 times faster compared to the use of a PMU. In addition, the OCIMU IDDQ monitor is built into our VLSI test system allowing IDDQ tests at wafer level without placing active components on the load board. This IDDQ methodology applies many IDDQ vectors, achieves a high fault coverage and is feasible in a production environment. Correlation between functional failures and IDDQ failures is around 70% for three CLSI designs. Extrapolation implies that the slip-through (i.e. bad devices that pass all tests) can be reduced by 70% by augmenting the test program with an IDDQ test. As a consequence, the non-quality costs can be reduced significantly depending on the slip-through figures, component and repair costs
  • Keywords
    CMOS digital integrated circuits; VLSI; application specific integrated circuits; fault location; integrated circuit testing; production testing; subscriber loops; 200 ms; ASICs; CLSI; IDDQ test vector selection; asymmetric digital subscriber line; extrapolation; fault coverage; functional failures; non-quality costs; production environment; pseudo stuck-at fault coverage; repair costs; slip-through; wafer level; CMOS technology; Capacitance; Circuit faults; Circuit testing; Costs; Monitoring; Phasor measurement units; System testing; Telecommunications; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1996. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-3541-4
  • Type

    conf

  • DOI
    10.1109/TEST.1996.557068
  • Filename
    557068