• DocumentCode
    2048531
  • Title

    Matching models to real life for defect reduction

  • Author

    Tuttle, James A. ; Collins, Thomas W. ; Tuttle, Mary Stone

  • Author_Institution
    J.A. Tuttle Associates Ltd., USA
  • fYear
    1995
  • fDate
    21-25 Oct 1995
  • Firstpage
    217
  • Lastpage
    223
  • Abstract
    This paper describes a method for quantitatively linking easily measurable parameters [defectivity in parts per million (PPM), test effectiveness (TE), failures in time rates (FIT)] with both customer and producer valued metrics. It describes a process by which test data derived from assembled printed circuit board (PCB) test and the determination of process capability are quantitatively linked. How these derived values relate to continuous improvement activities in PCB assembly, test, component supply and design quality is also discussed, as is the use of this data as a feed forward to the design of future products. Typical examples of our experiences at Tandem Computers are included to illustrate the implementation of the techniques
  • Keywords
    budgeting; circuit optimisation; concurrent engineering; design for manufacture; design for testability; integrated circuit yield; printed circuit testing; production testing; reliability; reliability theory; assembled printed circuit board test; board functional test; budgeting; component supply; concurrent engineering; customer valued metrics; defect reduction; defectivity in parts per million; design quality; failures in time rates; in-circuit test; matching models; operational parameters; process capability; producer valued metrics; product quality; real life matching; reliability growth; system test; test effectiveness; Assembly; Circuit testing; Costs; Manufacturing processes; Printed circuits; Process design; Production facilities; Resource management; Systems engineering and theory; Tellurium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1995. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-2992-9
  • Type

    conf

  • DOI
    10.1109/TEST.1995.529836
  • Filename
    529836