• DocumentCode
    2048849
  • Title

    Hardware technology for Hitachi M-880 processor group

  • Author

    Kobayashi, Fumiyuki ; Watanabe, Yutaka ; Yamamoto, Masakazu ; Anza, Akio ; Takahashi, Asami ; Daikoku, Takahiro ; Fujita, Tuyoshi

  • Author_Institution
    Hitachi Ltd., Kanagawa, Japan
  • fYear
    1991
  • fDate
    11-16 May 1991
  • Firstpage
    693
  • Lastpage
    703
  • Abstract
    The authors explain the high-speed high-density semiconductor technology and high-density installation technology developed for the super-high-speed high-reliability M-880 processor groups. To achieve the design goals, a set of advanced hardware technologies has been developed in such areas as semiconductor, ceramic module board, printed circuit board, electric part, cooling, and power feeding. The innovative hardware technologies have been brought into realization by the development of advanced manufacturing techniques and process techniques in addition to the conventional design automation techniques, inspection and diagnosis techniques, and reliability evaluation techniques. During the design, high-precision high-efficiency design evaluations were carried out using software simulation technologies including a three-dimensional electrical characteristic analyzing program a circuit analyzing program, and a thermal stress analyzing program
  • Keywords
    computer installation; cooling; electronic engineering computing; microprocessor chips; packaging; printed circuit design; reliability; semiconductor technology; Hitachi M-880 processor group; ceramic module board; circuit analyzing program; cooling; electrical characteristic analyzing program; high-density installation technology; high-density semiconductor technology; manufacturing techniques; power feeding; printed circuit board; reliability evaluation; software simulation technologies; thermal stress analyzing program; Ceramics; Circuit analysis; Cooling; Design automation; Hardware; Manufacturing automation; Manufacturing processes; Printed circuits; Semiconductor device manufacture; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1991. Proceedings., 41st
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    0-7803-0012-2
  • Type

    conf

  • DOI
    10.1109/ECTC.1991.163956
  • Filename
    163956