DocumentCode :
2048997
Title :
Semiconductor technology computer aided design
Author :
O´Neill, A.G.
Author_Institution :
Newcastle upon Tyne Univ., UK
fYear :
1996
fDate :
10-12 Apr 1996
Firstpage :
235
Lastpage :
240
Abstract :
Technology computer aided design (TCAD) plays a crucial role in developing new process technologies, reducing the time to market and improving device design. Commercially available TCAD tools can now be described as virtual wafer fabs, where all aspects of device processing, electrical simulation, device testing and reliability analysis are available in a seamless software environment. This paper focuses largely on TCAD for CMOS, which is the workhorse of the silicon chip industry. The technology makes use of MOSFETs and a schematic diagram of such a transistor is shown. The two methods of device simulation each offer their own advantages and short-comings. The Monte Carlo method in effect includes all possible moments in its carrier distribution function. It is based on the physics of electronic band structure and specific scattering events, and so is fundamentally the more accurate method. An ensemble Monte Carlo simulation is shown, where a buried channel MOSFET is simulated. The calculation of leakage currents is straight forward for the method of moments, once differential equations have been solved. The concern with this approach is the validity and accuracy of the equations used
Keywords :
semiconductor technology; CMOS; Monte Carlo method; TCAD; buried channel MOSFET; carrier distribution; device design; device processing; device testing; differential equations; electrical simulation; electronic band structure; leakage currents; method of moments; physics; reliability analysis; scattering events; seamless software environment; semiconductor process technologies; semiconductor technology; silicon chip industry; technology computer aided design; virtual wafer;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Computation in Electromagnetics, Third International Conference on (Conf. Publ. No. 420)
Conference_Location :
Bath
ISSN :
0537-9989
Print_ISBN :
0-85296-657-1
Type :
conf
DOI :
10.1049/cp:19960191
Filename :
681127
Link To Document :
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