DocumentCode :
2049168
Title :
Multilevel full-chip routing for the X-based architecture
Author :
Ho, Tsung-Yi ; Chang, Chen-Feng ; Chang, Yao-Wen ; Chen, Sao-Jie
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear :
2005
fDate :
13-17 June 2005
Firstpage :
597
Lastpage :
602
Abstract :
As technology advances into the nanometer territory, the interconnect delay has become a first-order effect on chip performance. To handle this effect, the X-architecture has been proposed for high-performance integrated circuits. The X-architecture presents a new way of orienting a chip´s microscopic interconnect wires with the pervasive use of diagonal routes. It can reduce the wire-length and via count, and thus improve performance and routability. Furthermore, the continuous increase of the problem size of IC routing is also a great challenge to existing routing algorithms. In this paper, we present the first multilevel framework for full-chip routing using the X-architecture. To take full advantage of the X-architecture, we explore the optimal routing for three-terminal nets on the X-architecture and develop a general X-Steiner tree algorithm based on the Delaunay triangulation approach for the X-architecture. The multilevel routing framework adopts a two-stage technique of coarsening followed by uncoarsening, with a trapezoid-shaped track assignment embedded between the two stages to assign long, straight diagonal segments for wirelength reduction. Compared with the state-of-the-art multilevel routing for the Manhattan architecture, experimental results show that our approach reduced wirelength by 18.7% and average delay by 8.8% with similar routing completion rates and via counts.
Keywords :
integrated circuit interconnections; integrated circuit layout; mesh generation; network routing; trees (mathematics); Delaunay triangulation; Manhattan architecture; X-based architecture; diagonal routes; general X-Steiner tree algorithm; high-performance integrated circuits; integrated circuit routing; interconnect delay; microscopic interconnect wires; multilevel full-chip routing; three-terminal nets; trapezoid-shaped track assignment; via count reduction; wirelength reduction; Algorithm design and analysis; Computational geometry; Delay effects; Design optimization; Integrated circuit interconnections; Integrated circuit technology; Microscopy; Permission; Routing; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2005. Proceedings. 42nd
Print_ISBN :
1-59593-058-2
Type :
conf
DOI :
10.1109/DAC.2005.193880
Filename :
1510400
Link To Document :
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