• DocumentCode
    2049219
  • Title

    Survey of characterization and metrology for nanoelectronics

  • Author

    Diebold, Alain C.

  • Author_Institution
    Coll. of Nanoscale Sci. & Eng., Univ. at Albany, Albany, NY
  • fYear
    2008
  • fDate
    April 27 2008-May 1 2008
  • Firstpage
    50
  • Lastpage
    51
  • Abstract
    Advances in process technology enable high volume manufacture of integrated circuits with nano-scale transistor and interconnect technology. This fabrication capability results in the availability of a great range of nano-scale materials and structures such as nano-tubes, thin films, nano-dots, and nanowires. Many of these materials are under consideration as the material for beyond CMOS switches. There are two themes emphasized in this paper. First, materials exhibit new phenomena such as quantum confinement at nano-scale dimensions. Measurements not only observe these phenomena, determination of the dimensions of nanoscale materials requires understanding of these phenomena. Second, simulation and modeling at nano-scale dimensions is critical to both device operation and metrology. This extended abstract reviews the materials characterization and metrology methods necessary for measuring materials properties. This abstract covers several of the many measurement methods necessary for nanoscale characterization and metrology.
  • Keywords
    nanoelectronics; nanostructured materials; nanotechnology; metrology; nanoelectronics; nanoscale dimensions; nanoscale materials; quantum confinement; CMOS technology; Integrated circuit interconnections; Integrated circuit manufacture; Integrated circuit technology; Manufacturing processes; Metrology; Nanoelectronics; Nanostructured materials; Nanostructures; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4244-2049-0
  • Electronic_ISBN
    978-1-4244-2050-6
  • Type

    conf

  • DOI
    10.1109/RELPHY.2008.4558862
  • Filename
    4558862