CMOS multichip module test vehicle with TAB´d components

Author

Wesling, Paul ; Shiao, Jack ; Chung, Tom ; Pan, Tony ; De Simone, Dave

Author_Institution

Tandem Comput. Inc., Cupertino, CA, USA

fYear

1991

fDate

11-16 May 1991

Firstpage

712

Lastpage

718

Abstract

A number of steps need to be taken during the development cycle for multichip modules prior to using them in a production system. The authors described a series of test vehicles used to establish the technical feasibility and the design rules for use of multichip modules. Particular focus is placed on a 4×4 in test substrate, consisting of two wire layers, two power layers, and a pad layer. Tests performed on this substrate are intended to yield information on materials properties, electrical performance, thermal performance, and assembly issues. Preliminary results are reported for some electrical characteristics for the substrate

Keywords

CMOS integrated circuits; hybrid integrated circuits; integrated circuit testing; modules; tape automated bonding; CMOS multichip module test vehicle; assembly issues; design rules; electrical characteristics; electrical performance; multichip modules; pad layer; power layers; production system; technical feasibility; test vehicles; thermal performance; wire layers; Assembly; CMOS process; Electric variables; Materials testing; Multichip modules; Packaging; Routing; Vehicles; Very large scale integration; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1991. Proceedings., 41st

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-0012-2

Type

conf

DOI

10.1109/ECTC.1991.163958

Filename

163958