CMOS multichip module test vehicle with TAB´d components

A number of steps need to be taken during the development cycle for multichip modules prior to using them in a production system. The authors described a series of test vehicles used to establish the technical feasibility and the design rules for use of multichip modules. Particular focus is placed on a 4×4 in test substrate, consisting of two wire layers, two power layers, and a pad layer. Tests performed on this substrate are intended to yield information on materials properties, electrical performance, thermal performance, and assembly issues. Preliminary results are reported for some electrical characteristics for the substrate