DocumentCode :
2049889
Title :
A new on-state drain-bias TDDB lifetime model and HCI effect on drain-bias TDDB of ultra thin oxide
Author :
Liao, P.J. ; Chen, Chia Lin ; Young, J.W. ; Tsai, Y.S. ; Wang, C.J. ; Wu, Kenneth
Author_Institution :
Reliability Assurance Div. 121, Taiwan Semicond. Manuf. Co., Hsinchu
fYear :
2008
fDate :
April 27 2008-May 1 2008
Firstpage :
210
Lastpage :
214
Abstract :
For the first time, a new drain-bias TBD lifetime model is proposed to precisely predict at various Vd, Vg and channel length for ultra thin oxide. The TBD lifetime with drain-bias can be decoupled to small voltage drop at drain-side increased TBD lifetime and hot carrier effect (HCI) degraded the TBD lifetime. The mechanism of oxide breakdown with drain-bias is also well understood as oxide traps distributed from the source side to the center of channel induce the oxide breakdown.
Keywords :
electron traps; hot carriers; semiconductor device breakdown; channel length; drain-bias lifetime model; hot carrier effect; oxide breakdown mechanism; oxide traps; time dependent dielectric breakdown; ultra thin oxide; voltage drop; Circuits; Degradation; Electric breakdown; Hot carrier effects; Human computer interaction; Semiconductor device manufacture; Stress; Virtual manufacturing; Voltage; Weibull distribution; HCI effect on GOX; TDDB; Ultra-Thin Oxide;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-2049-0
Electronic_ISBN :
978-1-4244-2050-6
Type :
conf
DOI :
10.1109/RELPHY.2008.4558888
Filename :
4558888
Link To Document :
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