DocumentCode
2049934
Title
Prediction of conducted emissions produced by a DC-DC-converter using component parasitics and partial inductances
Author
Wesling, Soren ; Dickmann, Stefan
Author_Institution
Fac. of Electr. Eng., Helmut Schmidt Univ., Hamburg, Germany
fYear
2013
fDate
2-6 Sept. 2013
Firstpage
627
Lastpage
631
Abstract
In this contribution, a comprehensive approach to predicting conducted emissions produced by a switched-mode power converter is presented. The prediction is based on a SPICE model. As an example, a DC-DC-converter is analyzed. Both the semiconductors (MOSFET, diode etc.) and the passive discrete elements as inductors and capacitors are modeled by processing datasheet information, manufacturer-provided models and/or measurements. In order to include parasitic inductances of a converter´s printed circuit board in the model, the concept of partial inductances is applied. The parasitic inductance extraction is merely based on CAD/layout data of the PCB. Hence, an existing prototype of the switched-mode power converter´s printed circuit board is not required to perform the prediction. Thus, the prediction can be done early in the development process. To ensure comparability of prediction results and EMC regulation measurements, the measurement setup (line impedance stabilization network, load, interconnections, EMI test receiver signal processing) is modeled. The applicability of the proposed approach is validated by performing an emissions measurement and comparison of prediction and measurement. The approach is suitable to predict an upper emissions level boundary.
Keywords
DC-DC power convertors; capacitors; electromagnetic compatibility; electromagnetic interference; inductors; printed circuit layout; switched mode power supplies; CAD/layout data; DC-DC-converter; EMC regulation measurements; EMI test receiver signal processing; PCB; SPICE model; capacitors; component parasitics; conducted emissions; datasheet information; development process; emissions measurement; inductors; line impedance stabilization network; manufacturer-provided models; parasitic inductance extraction; partial inductances; passive discrete elements; printed circuit board; switched-mode power converter; upper emissions level boundary; Electromagnetic compatibility; Electromagnetic interference; Integrated circuit modeling; SPICE; Semiconductor device measurement; Solid modeling; Time-domain analysis; conducted emissions; power electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC EUROPE), 2013 International Symposium on
Conference_Location
Brugge
ISSN
2325-0356
Type
conf
Filename
6653378
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