DocumentCode :
2049934
Title :
Prediction of conducted emissions produced by a DC-DC-converter using component parasitics and partial inductances
Author :
Wesling, Soren ; Dickmann, Stefan
Author_Institution :
Fac. of Electr. Eng., Helmut Schmidt Univ., Hamburg, Germany
fYear :
2013
fDate :
2-6 Sept. 2013
Firstpage :
627
Lastpage :
631
Abstract :
In this contribution, a comprehensive approach to predicting conducted emissions produced by a switched-mode power converter is presented. The prediction is based on a SPICE model. As an example, a DC-DC-converter is analyzed. Both the semiconductors (MOSFET, diode etc.) and the passive discrete elements as inductors and capacitors are modeled by processing datasheet information, manufacturer-provided models and/or measurements. In order to include parasitic inductances of a converter´s printed circuit board in the model, the concept of partial inductances is applied. The parasitic inductance extraction is merely based on CAD/layout data of the PCB. Hence, an existing prototype of the switched-mode power converter´s printed circuit board is not required to perform the prediction. Thus, the prediction can be done early in the development process. To ensure comparability of prediction results and EMC regulation measurements, the measurement setup (line impedance stabilization network, load, interconnections, EMI test receiver signal processing) is modeled. The applicability of the proposed approach is validated by performing an emissions measurement and comparison of prediction and measurement. The approach is suitable to predict an upper emissions level boundary.
Keywords :
DC-DC power convertors; capacitors; electromagnetic compatibility; electromagnetic interference; inductors; printed circuit layout; switched mode power supplies; CAD/layout data; DC-DC-converter; EMC regulation measurements; EMI test receiver signal processing; PCB; SPICE model; capacitors; component parasitics; conducted emissions; datasheet information; development process; emissions measurement; inductors; line impedance stabilization network; manufacturer-provided models; parasitic inductance extraction; partial inductances; passive discrete elements; printed circuit board; switched-mode power converter; upper emissions level boundary; Electromagnetic compatibility; Electromagnetic interference; Integrated circuit modeling; SPICE; Semiconductor device measurement; Solid modeling; Time-domain analysis; conducted emissions; power electronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC EUROPE), 2013 International Symposium on
Conference_Location :
Brugge
ISSN :
2325-0356
Type :
conf
Filename :
6653378
Link To Document :
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