DocumentCode
2050166
Title
NBTI degradation: From transistor to SRAM arrays
Author
Huard, V. ; Parthasarathy, C. ; Guerin, C. ; Valentin, T. ; Pion, E. ; Mammasse, M. ; Planes, N. ; Camus, L.
Author_Institution
STMicroelectronics, Crolles
fYear
2008
fDate
April 27 2008-May 1 2008
Firstpage
289
Lastpage
300
Abstract
A novel composite model had been recently introduced to physically explain the mean pMOS threshold voltage shift (VTP) induced by NBTI degradation at transistor level in a quantitative way. This model is here extended to include the statistical variations introduced by intrinsic fluctuations. In a second time, the model is extrapolated up to SRAM arrays by analyzing the SRAM bitcell sensitivity to transistor degradation. This approach allows quantitative prediction of NBTI-induced VMIN variations and access time Taa degradation during burn-in operations. The key findings include (a) demonstration of non-normality of VTP shift distribution (b) NBTI contribution to product VMIN drift arises from both mean VTP drift but also from increased VTP dispersion, and (c) VTP shift non-normality is smoothed out at product level by time-zero variation of the six transistors of the SRAM bitcell.
Keywords
MOS memory circuits; MOSFET; SRAM chips; integrated circuit modelling; integrated circuit reliability; semiconductor device models; semiconductor device reliability; statistical analysis; thermal stability; NBTI degradation; SRAM arrays; SRAM bitcell sensitivity; access time degradation; burn-in operations; composite model; intrinsic fluctuations; mean pMOS threshold voltage shift; static noise margin; statistical variations; time-zero variation; transistor level; voltage dispersion; write margin; Degradation; Electronic mail; Interface states; Mesons; Niobium compounds; Random access memory; Stress; Temperature; Titanium compounds; Voltage; Access time; NBTI; SRAM; Skellam; Static Noise Margin; Write Margin; composite model;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
Conference_Location
Phoenix, AZ
Print_ISBN
978-1-4244-2049-0
Electronic_ISBN
978-1-4244-2050-6
Type
conf
DOI
10.1109/RELPHY.2008.4558900
Filename
4558900
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