DocumentCode
2050384
Title
Impact of crystallinity of High-k oxides on Vt instabilities of NMOS devices assessed by physical and electrical measurements
Author
Garros, X. ; Besson, P. ; Reimbold, G. ; Loup, V. ; Salvetat, T. ; Rochat, N. ; Lhostis, S. ; Boulanger, F.
Author_Institution
CEA-Leti, Grenoble
fYear
2008
fDate
April 27 2008-May 1 2008
Firstpage
330
Lastpage
334
Abstract
This paper investigates the impact of crystallinity of HfO2 oxides on VT instabilities. Wet etch rate measurements enhances a critical thickness tHK C for HfO2 which marks the transition between a monoclinic crystalline phase to a near amorphous state, both clearly identified by ATR FTIR. Using electrical measurements and modeling, it is demonstrated that this transition from the crystalline phase to an amorphous state is accompanied by a strong reduction of the density of bulk HfO2 defects responsible for electron trapping, Prevents the crystallization of an high-k layer is therefore fundamental to improve its BTI reliability.
Keywords
Fourier transform spectra; MOSFET; attenuated total reflection; crystallisation; electron traps; hafnium compounds; infrared spectra; titanium compounds; ATR FTIR; Fourier transform infrared specta; NMOS devices; TiN-HfO2; amorphous state; attenuated total reflection; critical thickness; crystallinity; crystallization; defect density; electron trapping; high-k oxides; monoclinic crystalline phase; phase transition; wet etch rate; Amorphous materials; Crystallization; Electric variables measurement; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; MOS devices; Phase measurement; Thickness measurement; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
Conference_Location
Phoenix, AZ
Print_ISBN
978-1-4244-2049-0
Electronic_ISBN
978-1-4244-2050-6
Type
conf
DOI
10.1109/RELPHY.2008.4558907
Filename
4558907
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