• DocumentCode
    2050843
  • Title

    Control of crystalline and electronic structures of carbon nanowalls for their device applications

  • Author

    Kondo, Hiroki ; Hori, Masaru ; Hiramatsu, Mineo

  • Author_Institution
    Dept. of Electr. Eng. & Comput. Sci., Nagoya Univ., Nagoya, Japan
  • fYear
    2010
  • fDate
    21-24 Nov. 2010
  • Firstpage
    972
  • Lastpage
    975
  • Abstract
    Controlling factors of crystalline and electronic structures of carbon nanowalls were investigated in this study. Precise measurements and controls of radicals and ions in the plasma make the controlled syntheses of CNWs possible. For example, density ratios of hydrogen (H) and carbon atoms are essential to determine the density and height of CNWs. Ar+ ion irradiation is also important for vertical-growth of graphene sheets. Vertical-growth of graphene sheets could occur only under Ar+ ion irradiation with suitable energy and flux for each process. On the other hand, by N2 gas addition to C2F6/H2/Ar mixture ambient, the CNWs with n-type conducting properties can be formed. These results obtained in this study suggest that the CNWs are promising as new functional device materials in various applications.
  • Keywords
    association; electronic structure; elemental semiconductors; free radicals; gas mixtures; graphene; ion beam effects; nanostructured materials; plasma CVD; Ar+ ion irradiation; C; C2F6-H2-Ar mixture ambient; CNW density; CNW height; N2 gas addition; carbon atoms; carbon nanowalls; controlling factors; crystalline structures; density ratios; device applications; electronic structures; functional device materials; graphene sheet vertical-growth; hydrogen atoms; n-type conducting properties; plasma ions; plasma radicals; precise measurements; Carbon nanowall; graphene; ion; plasma-enhanced chemical vapor deposition; radical;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2010 - 2010 IEEE Region 10 Conference
  • Conference_Location
    Fukuoka
  • ISSN
    pending
  • Print_ISBN
    978-1-4244-6889-8
  • Type

    conf

  • DOI
    10.1109/TENCON.2010.5686534
  • Filename
    5686534