• DocumentCode
    2050972
  • Title

    Electric conduction improvement of well-structured multi-walled carbon nanotubes

  • Author

    Tsai, J.T.H. ; Chiao, Y.T. ; Zhang, Y. ; Milne, W.I.

  • Author_Institution
    Grad. Inst. of Electro-Opt. Eng., Tatung Univ., Taipei, Taiwan
  • fYear
    2010
  • fDate
    21-24 Nov. 2010
  • Firstpage
    963
  • Lastpage
    965
  • Abstract
    We characterized the electrical conductance of well-structured multi-walled carbon nanotubes (MWCNTs) which had post-treated by a rapid vacuum arc thermal annealing process and structure defects in these nanotubes are removed. We found that the after rapid vacuum arc annealing, the conductivity of well-structured MWCNTs can be improved by an order of magnitude. We also investigated the conductivity of MWCNTs bundle by the variation of temperatures. These results show that the conductance of annealed defect-free MWCNTs is sensitive to temperature imply the phonon scatting dominated the electron conductions. Compare to the well-structured MWCNTs, the defect scattering dominated the electron conduction in the as-grown control sample which has large amount of structure defects. A detail measurement of electron conduction from an individual well-structured MWCNT shows that the conductivity increases with temperatures which imply such MWCNTs exhibited semiconductor properties. We also produced back-gated field-effect transistors using these MWCNTs. It shows that the well-structured MWCNT can act as p-type semiconductor.
  • Keywords
    carbon nanotubes; crystal defects; electrical conductivity; field effect transistors; phonons; rapid thermal annealing; vacuum arcs; C; back-gated field-effect transistors; defect scattering; electrical conductivity; electron conductions; multiwalled carbon nanotubes; p-type semiconductor; phonon scatting; rapid vacuum arc thermal annealing; semiconductor properties; structure defects; well-structured MWCNT; microanalysis; rapid solidification; recrystallization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON 2010 - 2010 IEEE Region 10 Conference
  • Conference_Location
    Fukuoka
  • ISSN
    pending
  • Print_ISBN
    978-1-4244-6889-8
  • Type

    conf

  • DOI
    10.1109/TENCON.2010.5686539
  • Filename
    5686539