• DocumentCode
    2051136
  • Title

    Reliability considerations for implantable medical ICs

  • Author

    Porter, Mark ; Gerrish, Paul ; Tyler, Larry ; Murray, Sharon ; Mauriello, Rob ; Soto, Frank ; Phetteplace, Gaylene ; Hareland, Scott

  • Author_Institution
    Medtronic Microelectron. Center, Tempe, AZ
  • fYear
    2008
  • fDate
    April 27 2008-May 1 2008
  • Firstpage
    516
  • Lastpage
    523
  • Abstract
    Implantable medical devices continue to grow in complexity, mirroring the ascent of the semiconductor industry along the Moorepsilas Law curve. Traditionally, implantable applications have taken a fast-follower approach to silicon adoption, using more mature technologies to reduce risk. While commercial manufacturers, in some circumstances, may be able to trade off lifetime requirements for performance, this is decidedly not the case for implantable use, where 10 to 12 year requirements are typical. On the other hand, hardware and software redundancy solutions employed by high reliability avionics, telecommunications, and servers are difficult to implement in a battery-powered device, where current drain restrictions are severe. This paper discusses some of the reliability challenges faced by implantable device manufacturers as the need to provide more sophisticated therapy and diagnostics requires increasingly advanced technologies.
  • Keywords
    biomedical electronics; integrated circuit reliability; prosthetics; Implantable medical devices; integrated circuits; medical electronics; reliability; Aerospace electronics; Electronics industry; Hardware; Implantable biomedical devices; Medical diagnostic imaging; Moore´s Law; Pulp manufacturing; Redundancy; Semiconductor device manufacture; Silicon; high-reliability electronics; implantable devices; medical electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4244-2049-0
  • Electronic_ISBN
    978-1-4244-2050-6
  • Type

    conf

  • DOI
    10.1109/RELPHY.2008.4558939
  • Filename
    4558939