• DocumentCode
    2051797
  • Title

    Reliability assessment of high temperature electronics and packaging technologies for Venus mission

  • Author

    Chen, Yuan ; Castillo, Linda Del ; Aranki, Nazeeh ; Assad, Chris ; Mazzola, Mike ; Mojarradi, Mohammad ; Kolawa, Elizabeth

  • Author_Institution
    Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA
  • fYear
    2008
  • fDate
    April 27 2008-May 1 2008
  • Firstpage
    641
  • Lastpage
    642
  • Abstract
    In this paper, the potentials of the current state-of-the-art electronics and packaging technologies for Venus missions is evaluated and intend to address the survivability and reliability of the selected technologies and develop design-for-reliability guidelines for mission integration.
  • Keywords
    electronics packaging; high-temperature electronics; reliability; Venus mission; high temperature electronics; packaging technology; reliability assessment; Degradation; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Laboratories; Performance evaluation; Stress; Temperature sensors; Venus; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
  • Conference_Location
    Phoenix, AZ
  • Print_ISBN
    978-1-4244-2049-0
  • Electronic_ISBN
    978-1-4244-2050-6
  • Type

    conf

  • DOI
    10.1109/RELPHY.2008.4558966
  • Filename
    4558966
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2051797