• DocumentCode
    2051943
  • Title

    Stuck-at faults, PPMs rejects or? What do the SIA roadmaps say?

  • Author

    Baker, Keith

  • Author_Institution
    Philips Res. Lab., Eindhoven, Netherlands
  • fYear
    1995
  • fDate
    21-25 Oct 1995
  • Firstpage
    299
  • Abstract
    In 1995, the Semiconductor Industry Association (SIA) has released its updated National Technology Roadmaps for Semiconductors. In this document an attempt has been made to define trends in the test technology area in a rigorous fashion, with a much broader focus on design and test. Because of the dominate position of the US in semiconductors, this roadmap can be seen as an international road map thus very influential on the worldwide electronics industry. In the test technology parts of the road maps it can be seen that the general approach of defect oriented testing at block and IC level using IDDq testing combined with voltage testing proposed in this report is supported. One minor problem area foreseen in the SIA 1995 roadmaps by Philips, amongst others, is the uncertainty on the position of open defects and corresponding open fault models. It is foreseen that fault models for opens should be planned for the period 2005-2007 in the next series of SIA roadmap
  • Keywords
    electric current measurement; electronics industry; fault diagnosis; integrated circuit testing; logic testing; production testing; semiconductor device testing; voltage measurement; 1995; IDDq testing; IC; National Technology Roadmaps for Semiconductors; Philips; SIA; SIA roadmaps; Semiconductor Industry Association; US; electronics industry; fault models; open defects; stuck-at faults; Bridge circuits; Conductors; Current measurement; Electronics industry; Integrated circuit modeling; Integrated circuit testing; Laboratories; Roads; Semiconductor device testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1995. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-2992-9
  • Type

    conf

  • DOI
    10.1109/TEST.1995.529851
  • Filename
    529851