MEMS technology for the fabrication of RF magnetic components

Author

Allen, M.G.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2003

fDate

March 30 2003-April 3 2003

Abstract

MEMS technology can be utilized for the fabrication of magnetic structures in multiple frequency ranges, ranging from low-MHz metal-core devices for DC-DC converters to high-frequency dielectric or air core devices for RF application. They can also be fabricated in multiple locations: integral with silicon chips; in the interconnect layer between chip and board; and directly on the printed wiring board, in order to yield ultracompact magnetic microsystems. This payer describes examples of each of these fabrication approaches: high frequency dielectric-core inductors for CMOS power amplifiers integrated on chip; high-frequency air-core inductors fabricated within the interconnected layer between chip and board; and low-frequency metal-core inductors for DC-DC power conversion.

Keywords

CMOS analogue integrated circuits; DC-DC power convertors; ferromagnetic materials; inductors; iron; magnetic cores; micromechanical devices; power amplifiers; power conversion; CMOS power amplifiers; DC-DC converters; DC-DC power conversion; Fe; MEMS technology; RF application; RF magnetic components; air core devices; high frequency dielectric core inductors; high-frequency air core inductors; high-frequency dielectrics; interconnect layer; low MHz metal core devices; magnetic structures; printed wiring board; silicon chips; ultracompact magnetic microsystems; DC-DC power converters; Dielectric devices; Fabrication; Frequency conversion; Inductors; Magnetic cores; Magnetic devices; Micromechanical devices; Radio frequency; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Magnetics Conference, 2003. INTERMAG 2003. IEEE International

Conference_Location

Boston, MA, USA

Print_ISBN

0-7803-7647-1

Type

conf

DOI

10.1109/INTMAG.2003.1230694

Filename

1230694