Comprehensive reliability analysis of CoWP Metal Cap unit processes for high volume production in sub-μm dimensions

Author

Aubel, O. ; Thierbach, S. ; Seidel, R. ; Freudenberg, B. ; Meyer, M.A. ; Feustel, F. ; Poppe, J. ; Nopper, M. ; Preusse, A. ; Zistl, C. ; Weide-Zaage, K.

Author_Institution

AMD Saxony Ltd. Liability Co. & Co.KG, Dresden

fYear

2008

fDate

April 27 2008-May 1 2008

Firstpage

675

Lastpage

676

Abstract

Reliability of copper interconnect systems is very sensitive to the maximum current used in the product. In this paper we present the results of advanced process improvements leading to very reliable full-build interconnect systems ready for high volume production. Besides the electromigration investigation, we studied stress migration performance as well as BTS and leakage measurements. We found behavior changes in almost all reliability tests suggesting differences in physical behavior, while exhibiting very strong lifetime performance.

Keywords

cobalt alloys; copper; electromigration; integrated circuit interconnections; integrated circuit manufacture; integrated circuit reliability; platinum alloys; surface cleaning; tungsten alloys; BTS; CoWP; Cu; cleaning process; copper interconnect systems reliability; electromigration; high volume production; leakage measurements; lifetime performance; metal cap unit processes; physical behavior; stress migration performance; Cleaning; Copper; Current density; Electric breakdown; Electromigration; Life estimation; Production; Stress; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 2008. IRPS 2008. IEEE International

Conference_Location

Phoenix, AZ

Print_ISBN

978-1-4244-2049-0

Electronic_ISBN

978-1-4244-2050-6

Type

conf

DOI

10.1109/RELPHY.2008.4558983

Filename

4558983