Title :
Comprehensive reliability analysis of CoWP Metal Cap unit processes for high volume production in sub-μm dimensions
Author :
Aubel, O. ; Thierbach, S. ; Seidel, R. ; Freudenberg, B. ; Meyer, M.A. ; Feustel, F. ; Poppe, J. ; Nopper, M. ; Preusse, A. ; Zistl, C. ; Weide-Zaage, K.
Author_Institution :
AMD Saxony Ltd. Liability Co. & Co.KG, Dresden
fDate :
April 27 2008-May 1 2008
Abstract :
Reliability of copper interconnect systems is very sensitive to the maximum current used in the product. In this paper we present the results of advanced process improvements leading to very reliable full-build interconnect systems ready for high volume production. Besides the electromigration investigation, we studied stress migration performance as well as BTS and leakage measurements. We found behavior changes in almost all reliability tests suggesting differences in physical behavior, while exhibiting very strong lifetime performance.
Keywords :
cobalt alloys; copper; electromigration; integrated circuit interconnections; integrated circuit manufacture; integrated circuit reliability; platinum alloys; surface cleaning; tungsten alloys; BTS; CoWP; Cu; cleaning process; copper interconnect systems reliability; electromigration; high volume production; leakage measurements; lifetime performance; metal cap unit processes; physical behavior; stress migration performance; Cleaning; Copper; Current density; Electric breakdown; Electromigration; Life estimation; Production; Stress; Temperature; Testing;
Conference_Titel :
Reliability Physics Symposium, 2008. IRPS 2008. IEEE International
Conference_Location :
Phoenix, AZ
Print_ISBN :
978-1-4244-2049-0
Electronic_ISBN :
978-1-4244-2050-6
DOI :
10.1109/RELPHY.2008.4558983
