Title :
Nano-Roughening for Reliable N/MEMS Manufacture
Author :
Yang, Chia-Yeh ; Cheng, Y.T. ; Hsu, W.S.
Author_Institution :
Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu
Abstract :
This paper presents a nano-roughening technique to effectively modify bonding surface for ensuring for the continuation of hermetic encapsulation shrinkage from MEMS to NEMS. The roughening is realized via a non-uniform etch characteristic of PR which is etched then utilized as an etching mask for the following silicon etching process. UV adhesive bonding is utilized for the verification of the nano-roughening for NEMS hermetic encapsulation. The average roughnesses of silicon substrate before and after the modification are 0.4nm and 12.4nm respectively. The roughness increase can effectively provide more than 30% bonding strength enhancement and 8% leakage reduction
Keywords :
encapsulation; laser beam etching; micromechanical devices; nanoelectronics; silicon; surface roughness; N/MEMS manufacture; NEMS; Si; UV adhesive bonding; bonding strength; bonding surface; etching mask; hermetic encapsulation shrinkage; leakage reduction; nanoroughening; nonuniform etch; silicon etching; silicon substrate; Bonding; Costs; Encapsulation; Etching; Manufacturing; Micromechanical devices; Nanoelectromechanical systems; Rough surfaces; Silicon; Surface roughness; Bonding; Hermetic Encapsulation; NEMS Manufacture; Nano-roughening; UV Adhesive;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2006. NEMS '06. 1st IEEE International Conference on
Conference_Location :
Zhuhai
Print_ISBN :
1-4244-0139-9
Electronic_ISBN :
1-4244-0140-2
DOI :
10.1109/NEMS.2006.334659
